| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2136ad3742072843758e5b86a1e01e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2431-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2007-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aeffd74b0c264a4e6285339db2bc3248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be2f747fed170b335d2f80ac5d0a0092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a02ff6ddae81e8cad9ee996d26919ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b2dbe6bb6e624a3c368789015842930 |
| publicationDate |
2009-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2003685-A9 |
| titleOfInvention |
Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape |
| abstract |
The present invention provides a surface-protection tape for semiconductor wafers having an even thickness accuracy, excellent surface smoothness, and excellent surface sliding properties such as freedom from blocking, etc., and a substrate film for the surface-protection tape. The substrate film for the surface-protection tape for semiconductor wafers has at least one layer containing a polyethylene-based resin and satisfies the following requirements: n(1) the back and front surfaces of the substrate film have a surface roughness Ra measured based on JIS B0601 of not more than 0.8 µm, and at least one surface thereof has a surface roughness Ra of not less than 0.05 µm; and n(2) the difference between the maximum and minimum thicknesses of the substrate film is not more than 4 µm. n The present invention also provides a surface-protection tape for semiconductor wafers comprising the substrate film and an adhesive layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11276600-B2 |
| priorityDate |
2006-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |