| abstract |
Disclosed are an adhesive composition having high bond strength as well as being easily detachable and having superior heat resistance, adhesive tape using that adhesive composition as well as a semiconductor wafer treatment method using that adhesive tape and a method for producing a TSV wafer. The adhesive composition contains an adhesive component and a tetrazole compound represented by general formula (1), general formula (2) or general formula (3). In formulas (1) - (3), R 1 and R 2 represent hydrogen, a hydroxyl group, amino group, C 1-7 alkyl group, alkylene group, phenyl group or mercapto group. The C 1-7 alkyl group, alkylene group, phenyl group or mercapto group may be substituted. |