http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008159998-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
filingDate 2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c07368f14eac1c099f87a633ac6f1ea2
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publicationDate 2008-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008159998-A
titleOfInvention Dicing tape
abstract Disclosed is a dicing tape that can suppress chip parts from being scattered during dicing and can easily remove the obtained chip parts. A dicing tape 2 for a chip component in which a pressure-sensitive adhesive layer 2a is provided on one side of a base film 2b, the pressure-sensitive adhesive layer 2a being added to a pressure-sensitive adhesive and 100 parts by weight of the pressure-sensitive adhesive. A temperature-sensitive adhesive containing a side chain crystalline polymer in a proportion of 4 to 9 parts by weight, and a foaming agent in a proportion of 25 to 35 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive, The adhesive strength is reduced at a temperature equal to or higher than the melting point of the side chain crystalline polymer, the thickness is 35 to 45 μm, and the adhesive strength is 10 to 20 N / 25 mm at 23 ° C. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180090782-A
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type http://data.epo.org/linked-data/def/patent/Publication

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