| abstract |
The structure substantially does not contain a filler to prevent breakage of the semiconductor chip due to pressure at the time of die bonding, to prevent a decrease in tensile modulus, and to prevent warpage due to heat shrinkage during thermal curing. To provide a thermosetting adhesive film capable of improving package reliability. It is a thermosetting adhesive film used at the time of manufacture of a semiconductor device, the tensile storage modulus in 260 degreeC after thermosetting is 2 * 10 < 5> -5 * 10 < 7> Pa, and content of a filler is 0.1 weight with respect to the whole thermosetting adhesive film. It is% or less, and is a thermosetting adhesive film whose thickness is 1-10 micrometers. |