| abstract |
A wafer processing laminate is provided comprising a support ( 3 ), a temporary adhesive layer ( 2 ), and a wafer ( 1 ). The temporary adhesive layer ( 2 ) has a trilayer structure consisting of a first temporary bond layer (A) of thermoplastic siloxane bond-free polymer, a second temporary bond layer (B) of thermoplastic siloxane polymer, and a third temporary bond layer (C) of thermosetting modified siloxane polymer. In a peripheral region, the second layer (B) is removed so that the first layer (A) is in close contact with the third layer (C). |