abstract |
To provide an adhesive tape for semiconductor processing capable of suppressing cracking of a chip even when used for DBG, particularly LDBG. A pressure-sensitive adhesive tape for semiconductor processing according to the present invention is a pressure-sensitive adhesive tape having a base material having a Young's modulus at 23 ° C. of 1000 MPa or more and a pressure-sensitive adhesive layer provided on at least one surface side of the base material. When the thickness of the pressure-sensitive adhesive layer is (N) [μm] and the creep amount is (C) [μm], the product (N) × (C) of (N) and (C) is 30 500 or more at ℃ and 9000 or less at 60 ℃. [Selection figure] None |