| abstract |
An electronic component sealing resin sheet capable of improving the reliability of a resin-encapsulated semiconductor device is provided. A resin sheet for encapsulating an electronic component used for manufacturing a resin-encapsulated semiconductor device, the inorganic sheet containing 70 to 93% by weight based on the entire resin sheet for encapsulating an electronic component, A resin sheet for encapsulating electronic parts, wherein the moisture permeability after thermosetting when the thickness is 250 μm is 300 g / m 2 · 24 hours or less under the conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours. [Selection] Figure 1 |