| abstract |
[Problem] Form device wafers without deteriorating quality.n[Solution] A wafer processing method is to divide a wafer on which a plurality of devices are formed into individual device wafers. The aforementioned wafer processing method includes the following steps: a polyester-based sheet arrangement step, and the wafer The circle is positioned in the opening of the frame with the opening for accommodating the wafer, and the polyester-based sheet is arranged on the back or front of the wafer and the outer periphery of the frame; the integration step is to integrate the polyester-based sheet Heat and integrate the wafer and the frame through the polyester-based sheet by thermocompression bonding; in the dividing step, the wafer is irradiated with a laser of a wavelength that is penetrating to the wafer along the planned dividing line The light beam forms a shield through hole on the wafer, and the wafer is divided into individual device chips; and the picking step is to apply ultrasonic waves to the polyester-based sheet, push the device chips, and pick up The device wafer. |