| abstract |
Provided are a thermosetting die-bonding film and a dicing die-bonding film in which the thermosetting die-bonding film and the dicing film are laminated, which can significantly reduce work time during die bonding of a semiconductor chip. The thermosetting die bond film which concerns on this invention is a thermosetting die bond film used at the time of manufacture of a semiconductor device, The thermosetting catalyst whose content is in the range of 0.2-1 weight part with respect to 100 weight part of organic components in the said film is an amorphous state. It is characterized by containing. |