| abstract |
A pressure sensitive adhesive sheet for use innsemiconductor wafer working, comprising a substrate and,nsuperimposed thereon, a pressure sensitive adhesive layer, n wherein said pressure sensitive adhesive sheetnexhibits a one-minute-later stress relaxation ratio, at 10%nelongation, of at least 40% in a tensile test. Thisnpressure sensitive adhesive sheet for use in semiconductornwafer working enables grinding thin wafers and large-diameternwafers at the back side thereof until the wafersnhave an extremely small thickness without warping thenwafers. |