| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a819bbd2c40cecf0f6aba41d29f5752d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bbcd88657e696ab3a533bfe3b4231cec |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2461-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B55-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B55-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-22 |
| filingDate |
2004-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a0e267b31d060e83158352d8f6bd711 |
| publicationDate |
2013-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8349706-B2 |
| titleOfInvention |
Semiconductor surface protecting method |
| abstract |
Provided are a semiconductor surface protecting method and surface protecting sheet employing a material having adequate conformability for irregularities on semiconductor wafer circuit sides and sufficient rigidity as a support during grinding, and which does not become fluid with repeated temperature increases. Also provided is a surface protecting sheet for protection of the circuit side in the step of back side grinding of a semiconductor wafer, the surface protecting sheet having a polymeric film material with a surface protecting layer thereon that may become fluid upon heating and which hardens upon exposure to radiation or upon heating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9493686-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9335367-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11724362-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10745590-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9644118-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11685014-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11524384-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9909040-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11446788-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11772229-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11471999-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9818636-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9269623-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11745302-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9315696-B2 |
| priorityDate |
2003-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |