| abstract |
(57) [Problem] To provide a semiconductor wafer holding / protecting sheet capable of following the unevenness of a wafer surface even if the difference in the unevenness is large. SOLUTION: The hot melt sheet for holding and protecting a semiconductor wafer is a sheet for holding and protecting a semiconductor wafer by heating and attaching the semiconductor wafer to a surface of the semiconductor wafer during processing of the semiconductor wafer, and has a melting point of 105 ° C. or less. It has at least the layer A. The pressure-sensitive adhesive layer B may be formed on one surface of the hot melt layer A, or, when the pressure-sensitive adhesive layer B is formed on one surface of the hot melt layer A, or on one surface of the hot melt layer A, on the opposite surface. In addition, a reinforcing layer C having a melting point higher than the hot melt layer A by 20 ° C. or more may be formed. |