| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-08 |
| filingDate |
2003-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fbf458bd4553d5cce4ca36fa11d34b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3d26433eefddd903d371eec9ef406b7 |
| publicationDate |
2003-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1354925-A1 |
| titleOfInvention |
Heat-peelable pressure-sensitive adhesive sheet for electronic part, method of processing electronic part, and electronic part |
| abstract |
A heat-peelable pressure-sensitive adhesive sheet for electronic parts whichnafter a heat treatment can be easily peeled from the electronic parts while causing littlencontamination is disclosed. The heat-peelable pressure-sensitive adhesive sheet fornelectronic parts which has a heat-expandable layer containing heat-expandablenmicrospheres and a non-heat-expandable pressure-sensitive adhesive layer formed on atnleast one side of the heat-expandable layer, wherein when the pressure-sensitivenadhesive sheet is applied, on the side of the non-heat-expandable pressure-sensitivenadhesive layer, to a surface of a silicon wafer and is thereafter heated and peeled fromnthe wafer, then the carbon element proportion R C1 (%) on this silicon wafer surfacensatisfies at least either of the following relationships (1) and (2): R C1 ≤50+R C2 (1);nR C1 ≤2.5R Si (2), wherein R C2 represents the carbon element proportion (%) on the siliconnwafer surface before the application; and R Si represents the silicon element proportionn(%) on the silicon wafer surface after the non-heat-expandable pressure-sensitivenadhesive layer applied to the silicon wafer surface is heated and peeled therefrom. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8349706-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7521384-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10899120-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1608717-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1464688-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10890692-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1582572-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2578654-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8080121-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9873281-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2621558-C2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2621558-C9
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10434812-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014028031-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1889887-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010025047-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010025047-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8999503-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2078741-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104837644-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10800203-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2078741-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104837644-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1777734-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1777734-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-2019229332-B2 |
| priorityDate |
2002-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |