| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 |
| filingDate |
2004-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b81a01be5f717849923d67159e3c1fa3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb15b3ad3fdd66baacf53abd953d76c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f25ecd782c46789a0c771c686e04c26b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b54196c18392457dc4984d7eb5aef80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1df3d700c72e2b4f89bd5121a367efae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a49153df6022aaaf18d0957093a87ca7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68563569b71c46c4f14d56516be6de3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97b5d9834cc3c21bebcd7ff124f283bd |
| publicationDate |
2007-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1783820-A1 |
| titleOfInvention |
Process for producing ic chip |
| abstract |
It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 µm or thinner, for example, about 25 to 30 µm at a high productivity. n The invention is a method for producing an IC chip, which comprises; at least a step 1 of fixing a wafer in a support plate by sticking the wafer to the gas generating agent-containing face of a pressure sensitive adhesive double-faced tape having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by light radiation in at least one face; a step 2 of grinding the wafer in a state of being fixed in the support plate through the pressure sensitive adhesive double-faced tape; a step 3 of radiating light to the pressure sensitive adhesive double-faced tape; and a step 4 of separating the pressure sensitive adhesive double-faced tape from the wafer, a gas releasing speed from the pressure sensitive adhesive double-faced tape being 5 L/cm 2 ·min or higher in the step 3. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9153471-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2684928-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2684928-A2 |
| priorityDate |
2004-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |