| abstract |
The present invention is an adhesive composition for encapsulating an adhesive composition of an electronic device, comprising: a content ratio of a repetitive unit derived from isoprene, and an isobutylene having a total repetitive unit of 0.1 to 99 mol%. An isoprene copolymer as a main component; an adhesive sheet comprising: a release sheet; and an adhesive layer formed on the release sheet, wherein the adhesive layer is formed using the adhesive composition described above An adhesive sheet comprising: a gas barrier film; and an adhesive layer formed on the gas barrier film, wherein the gas barrier film has a water vapor permeability of 0.1 in a temperature of 40 ° C and a relative humidity of 90%. For g/m 2 /day or less, and the total light transmittance is 80% or more, the above adhesive layer is composed of isobutylene. The isoprene copolymer is composed of an adhesive composition as a main component; and an electronic device in which the above-described adhesive composition and the subsequent sheet are used as a package material such as an organic EL element. According to the present invention, it is possible to provide an adhesive composition, a sheet, an electronic device, and the like which are excellent in moisture barrier properties and which are excellent in adhesion, and which are excellent in adhesion. |