http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112930380-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
filingDate | 2020-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04fa688c7779cd0bba5b58a8fd1b41c7 |
publicationDate | 2021-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-112930380-A |
titleOfInvention | Film adhesive and sheet for semiconductor processing |
abstract | The present invention provides a thermosetting film-like adhesive which satisfies the following requirements: before being stored at 40°C for 7 days and before thermal curing, and after being stored at 40°C for 7 days and before thermal curing The following prerequisites 1) and 2): 1) the storage modulus G' at 80°C of the film-like adhesive is 3×10 4 Pa or less, 2) in the 10 mm×10 mm×20 μm described The film adhesive was press-bonded to a glass substrate having a copper wiring having a line width/space (L/S) of 100 μm/100 μm and a thickness of 10 μm by applying a load of 1.96 N for 1 second at 80° C. In the area of 1.1 mm x 5 mm in the central portion of the portion formed by the copper wiring side, the air residual ratio in 100 area % of the pitch portion was 20 area % or less. |
priorityDate | 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 155.