| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2011-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_155e016e602662b9f4cd2c13af01845f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fec481b7ef98c74252d2e171cd5252c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6a003b08186e359ae99e315d42b5e05 |
| publicationDate |
2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012167174-A |
| titleOfInvention |
Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a melt composition before thermosetting and a storage elastic modulus after thermosetting in an adhesive composition used for an adhesive layer of an adhesive sheet for dicing and die bonding having both a wafer fixing function and a die bonding function. By appropriately controlling, suppressing the deformation of the adhesive layer, maintaining the wire bonding suitability, and improving the reliability of the obtained semiconductor package. An adhesive composition according to the present invention includes an acrylic polymer (A), an epoxy thermosetting resin (B), and a thermosetting agent (C). The melt viscosity at 80 ° C. of the adhesive composition before thermosetting is 1.0 × 10 4 Pa · s or more, and the storage elastic modulus E ′ at 170 ° C. of the adhesive composition after thermosetting is 1. It is characterized by being 0 × 10 7 Pa or more. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10358580-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9868884-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10808150-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112930380-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9920227-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020196156-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112930380-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015140408-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015115553-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015229744-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11649379-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016135856-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11174415-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015115553-A1 |
| priorityDate |
2011-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |