http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112930380-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-12 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35 |
| filingDate | 2020-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112930380-B |
| titleOfInvention | Film adhesive and sheet for semiconductor processing |
| abstract | The present invention provides a thermosetting film-like adhesive, which satisfies the following requirements: The following requirements 1) and 2): 1) the storage modulus G' at 80°C of the film-like adhesive is 3×10 4 Pa or less, 2) the above-mentioned 10mm×10mm×20μm The film adhesive was press-bonded to a glass substrate having a copper wiring having a line width/space (L/S) of 100 μm/100 μm and a thickness of 10 μm by applying a load of 1.96 N for 1 second at 80° C. In the area of 1.1 mm x 5 mm in the central portion of the portion formed by the copper wiring side, the air residual ratio in 100 area % of the pitch portion was 20 area % or less. |
| priorityDate | 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 156.