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filingDate 2009-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101033044-B1
titleOfInvention Adhesive composition for semiconductor and die adhesive film comprising same
abstract 80 parts by weight to 50 parts by weight of an elastomer resin, 10 parts by weight to 20 parts by weight of an epoxy resin, and 20 parts by weight to 60 parts by weight of a bifunctional epoxy resin based on 100 parts by weight of an epoxy resin, and a polyfunctional exceeding bifunctionality. An adhesive composition comprising an epoxy resin comprising an epoxy resin, 1 to 10 parts by weight of a cured resin, 0.01 to 10 parts by weight of a curing accelerator, 0.01 to 10 parts by weight of a silane coupling agent, and 5 to 10 parts by weight of a filler , A composition having a shear viscosity of 2.30 × 10 6 poises to 1.5 × 10 6 poises at 170 ° C. after curing at 125 ° C. due to bifunctional epoxy, and a die for a semiconductor including the same Present the adhesive film.n n n n Adhesive Film, Semiconductor Adhesive, Shear Viscosity, Void, EMC, Molding
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