| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22 |
| filingDate |
2018-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22035088c3e998e73f1e3f375165a721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6349d6756b8be99582cb3045c11e10d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4920e9adbfa42cb05842fbeab026da49 |
| publicationDate |
2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
BR-112019019527-B1 |
| titleOfInvention |
semiconductor processing tape |
| abstract |
a semiconductor processing tape is provided which can be retracted by heating sufficiently in a short period of time and can retain a cut width. a semiconductor processing tape 10 of the invention includes a temporary adhesive tape 15 having a substrate film 11; and a temporary adhesive layer 12 formed on at least one side of the substrate film surface 11, in which, in relation to the temporary adhesive tape 15, the sum of the sum of the sum of the differential values of the thermal deformation rate in the direction md by 1ºc between 40ºc and 80ºc measured at the time of increasing the temperature using a thermomechanical testing machine, and the sum of the sum of the differential values of the thermal deformation rate in the td direction by 1ºc between 40ºc and 80ºc measured at the time of increasing the temperature by means of a thermomechanical testing machine, it is a negative value. |
| priorityDate |
2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |