| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-0225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6a6d24832d58f3686b75c74af5eab05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a4c349a9504fc151eb61aea309c99f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f343bafb31fb269cc585c1a8032d58 |
| publicationDate |
2017-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9716025-B2 |
| titleOfInvention |
Temporary bonding laminates for use in manufacture of semiconductor devices |
| abstract |
Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a first release layer having a softening point of 200° C. or more and adjoining the adhesive layer (B), and (a2) a second release layer adjoining the first release layer (a1); the second release layer (a2) contains a resin; and the resin after curing has a capable of being dissolved at 5% by mass or more, at 25° C., in at least one kind of solvents selected from hexane and the like. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D856007-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D857405-S |
| priorityDate |
2013-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |