| abstract |
A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2 , a separate film 5 provided on the first adhesive layer 4 , and a second adhesive layer 6 , provided on the separation film layer 5 , which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves. |