| abstract |
The present patent application relates to a wafer support arrangement, comprisingn a wafer ( 1 ), a support layer system ( 5, 6 ) and a separating layer ( 4 ), which is arranged between the support layer system ( 5, 6 ) and the wafer ( 1 ),n nwherein the support layer system ( 5, 6 )n (i) comprises a support layer ( 6 ) and (ii) a layer ( 5 ) from a through hardened, partially hardened or hardenable elastomer material on the separating layer side or consists of these two layers andn nwherein the separating layer ( 4 )n (iii) is a plasma polymer layer and (iv) the adhesive bond between the support layer system ( 5, 6 ) and the separating layer ( 4 ), after the elastomer material has through hardened, is greater than the adhesive bond between the wafer ( 1 ) and the separating layer ( 4 ). |