Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65d8e86431f68703bdfee82ccf958ac6 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68778 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 |
filingDate |
2013-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c90cd57ffa55caa8127bb4dd106d013f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf561cc27da4f1bbdc8785a6f82550e8 |
publicationDate |
2014-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2014070576-A2 |
titleOfInvention |
Led die dispersal in displays and light panels with preserving neighboring relationship |
abstract |
A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship. |
priorityDate |
2012-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |