| abstract |
Semiconductor chips (12), such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate (10) to maintain reasonably consistent spacing between adjacent chips. To remove a defective chip (12b) from the array, the substrate (10) is urged evenly against a work surface defining a convex bow. In an alternative embodiment (Fig.3), back-cuts (13) are provided along abutting edges of the chips (12), and the silicon around these back-cuts (13) can be sawed away to increase the space between a defective chip (12b) and neighboring good chips (12a,12c). By increasing the spacing of a defective chip (12b) from neighboring chips (12a,12c), the defective chip (12b) can be removed while minimizing the risk of damage to neighboring chips (12a,12c). Also, batches of chips (12) can be originally manfactured on a single wafer as either "regular" chips or "replacement" chips, with the replacement chips being slightly shorter in a critical dimension. |