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publicationDate 2009-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2009176349-A1
titleOfInvention Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
abstract A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
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