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filingDate 2003-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_665d677311e3e52905bbefc0bb77fa03
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publicationDate 2004-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2004051708-A2
titleOfInvention Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
abstract The invention relates to a method and a device for machining wafers, in particular for thinning wafers. The invention also relates to a wafer comprising a support layer and a separation layer that is situated between the support layer and the wafer. Said separation layer is a plasma polymer layer, which adheres to the wafer and adheres to the support layer more strongly than to the wafer.
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Total number of triples: 48.