| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-255
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-29 |
| filingDate |
2019-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_beaa3e2c57b1b59dad500314fc5a665a |
| publicationDate |
2021-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210043557-A |
| titleOfInvention |
Base material for adhesive sheet and adhesive sheet for electronic parts processing |
| abstract |
It has the polyester film 11 which has the 1st film surface 11A and the 2nd film surface 11B, the 1st oligomer sealing layer 21, and the 2nd oligomer sealing layer 22, and the polyester film ( 11) A cured coating obtained by curing the composition for forming an oligomer encapsulating layer containing a curable component independently of the silver, which has been annealed and the first oligomer encapsulating layer 21 and the second oligomer encapsulating layer 22 are each independently cured And, the first oligomer encapsulation layer 21 and the second oligomer encapsulation layer 22 substantially do not contain a filler, and the height of the root mean square of the first substrate surface 21A of the first oligomer encapsulation layer 21 At least one of Rq 1 and the root mean square height Rq 2 of the second substrate surface 22A of the second oligomer encapsulation layer 22 is 0.031 µm or more. |
| priorityDate |
2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |