| abstract |
Adhesive composition which can highly compatible the reliability of semiconductor devices, such as the filling property (filling property) with respect to a to-be-adhered body, low temperature lamination property, and reflow property, and the film-like adhesive and dicing sheet using the same In order to provide an adhesive sheet having excellent process characteristics such as reverse peeling property, and a semiconductor device having excellent productivity, high adhesive strength at the time of heat and excellent moisture resistance, (A) thermoplastic resin, (B) the following general formula (I) Provided is an adhesive composition comprising bisallynalideimide, and (C) a bifunctional or higher (meth) acrylate compound.n n n (Tue 1)n n n n n n n n (Wherein, R 1 represents a divalent organic group containing an aromatic ring and / or a linear, branched or cyclic aliphatic hydrocarbon.) |