| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 |
| filingDate |
2018-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c241985c47fba5992e9b8c581682fa24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c1b7f9b2541419806e7662ed8bcbbdc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_732eeb57df25018ae9ee8a08c27b70ba |
| publicationDate |
2019-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109423225-A |
| titleOfInvention |
Resin sheet, semiconductor device, and method of using the resin sheet |
| abstract |
The present invention provides a resin sheet which does not easily float at the interface between the resin composition layer and the support sheet even when the viscosity of the surface of the resin composition layer is low, and which is used for thermal curing of the resin composition layer even when the In the case of a manufacturing method of a semiconductor device in which the support sheet is then peeled off from the formed cured layer, the support sheet can be easily peeled off from the cured layer. A resin sheet (1) used for sealing an electronic component (2), the resin sheet (1) comprising a first support sheet (11) and a curable resin composition layer (10), and the resin composition layer (10) It is formed from a resin composition containing a thermosetting resin and inorganic fine particles, the content of the fine particles is 50 to 90% by mass and the average particle size is 0.01 to 3.0 μm, and the first support sheet (11) is provided with a support base (111) and the adhesive layer (112), and the resin composition layer (10) is laminated on the surface on the side of the adhesive layer (112). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113613897-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113613897-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112011296-A |
| priorityDate |
2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |