| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fda353b84ebf303bfc237d8bd8e22966 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2483-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2377-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2483-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2323-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-818
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2367-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2433-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-0427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate |
2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9311518853186f90561b41cb16c9c8ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c4468ccb868ae57f7e22ff6fed4cad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8991bb098f9c959556455733cde85791
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e73afd085543fde7754ebf0e2da3b7d |
| publicationDate |
2022-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2022289920-A1 |
| titleOfInvention |
Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method |
| abstract |
A method for producing an electronic device includes a first step of pasting a support to an organic substrate having a thickness of 1000 μm or less, with a temporary fixing material interposed therebetween, to obtain a laminated body; a second step of heating the temporary fixing material of the laminated body; a third step of mounting a semiconductor chip on the organic substrate of the laminated body that has been subjected to the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminated body that has been subjected to the fourth step. |
| priorityDate |
2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |