http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81005
Outgoing Links
| Predicate | Object |
|---|---|
| level | 11^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H01L2224/81005 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81001 |
Incoming Links
Total number of triples: 2780.