| abstract |
The present invention provides a pre-bumped redistribution layer (RDL) structure and a semiconductor package containing the pre-bumped RDL structure. The pre-embossed RDL structure includes: at least one dielectric layer having first and second opposite surfaces; a first metal layer on the first surface; and a second metal layer on the second surface And a via layer, which is electrically connected to the first metal layer and the second metal layer. At least one bump pad is formed in the first metal layer. A bump is disposed on the bump pad. The bump includes: a copper layer, the bottom end of which is directly bonded to the top surface of the bump pad. |