http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237
Outgoing Links
| Predicate | Object |
|---|---|
| level | 16^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H01L2224/16237 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
Incoming Links
Total number of triples: 3515.