| abstract |
According to the present invention, a method for manufacturing a high frequency module device includes a first unit wiring layer 5 to a third unit wiring layer 7 having a capacitor 12 or the like on a part of a flattened surface of a dummy substrate 30. By stacking, the high frequency circuit part 2 which the 3rd pattern wiring is exposed from the connection surface 2a of the uppermost layer is made to the mounting surface 3a of the base board 3 which exposes the input / output terminal part 18, and the 3rd pattern After realizing so that wiring and an input / output terminal part may be connected, a high frequency module apparatus is manufactured by removing a dummy board | substrate.n n n n Connection surface, dummy board, high frequency module device, base board |