| abstract |
(57) [Summary] [PROBLEMS] To achieve high precision, high performance and thinness, to reduce the size and cost of a package. SOLUTION: A release layer forming step for forming a release layer 6 on a flattened main surface of a mother substrate 1, an insulating layer forming step for forming insulating layers 7, 9, 16 on the release layer 6, The method includes a wiring layer forming step of forming the wiring layers 8, 11, and 14 on the layer 7, and a circuit block body peeling step of peeling the circuit block body 2 including the insulating layers and the wiring layers via the peeling layer. . The circuit block 2 includes film-forming elements 12, 1 in a wiring layer. The wiring devices 3 and 17 are built in and mounted on the base substrate 3. The circuit block 2 has a semiconductor chip 62 mounted on the surface and a base substrate 64 to constitute a semiconductor device. |