http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| level | 10^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H01L23/5389 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-538 |
Incoming Links
Total number of triples: 10000.