| abstract |
According to the present invention, a structure of a semiconductor device in which adhesive deposits are reduced and yield is excellent; and a process for manufacturing the same can be provided. A process for manufacturing a semiconductor device according to the present invention includes: a step of arranging plural semiconductor elements ( 106 ) on a main surface of a thermal release adhesive layer (mount film); a step of forming an encapsulant layer ( 108 ), which encapsulates the plural semiconductor elements ( 106 ) on the main surface of the mount film, using a semiconductor-encapsulating resin composition; and a step of peeling off the mount film to expose a lower surface ( 30 ) of the encapsulant layer ( 108 ) and lower surfaces ( 20 ) of the semiconductor elements ( 106 ). A contact angle of the lower surface ( 30 ) of the encapsulant layer ( 108 ) is less than or equal to 70° when measured using formamide after the step of peeling off the mount film. |