| abstract |
There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, mounting a second semiconductor device on a second nsurface of the interconnection structure layer opposite to the molding layer, and attaching a heat spreader to the second surface of the interconnection structure layer to overlap with a portion of the first semiconductor device. |