http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025
Outgoing Links
| Predicate | Object |
|---|---|
| level | 14^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H01L2224/13025 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Disposition the bump connector being disposed on a via connection of the semiconductor or solid-state body |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1302 |
Incoming Links
Total number of triples: 3610.