| abstract |
In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T 1 of the first semiconductor chip and a thickness T 2 of the second semiconductor chip satisfy a relationship of T 1 /(T 1 +T 2 )≦0.6. |