| abstract |
An apparatus comprising: a first set of one or more contacts on a first chip surface, the first set of one or more contacts to be coupled with contacts of an integrated circuit chip, one or more multi-level voltage clamps coupled to the first set of one or more contacts, one or more multi-level voltage clamps being switchable between two or more voltages, one or more integrated voltage regulators coupled to one or more voltage clamps multi-level, one or more integrated voltage regulators for providing an output voltage, one or more silicon through vias (TSVs) coupled to one or more integrated voltage regulators, and a second set of one or more contacts on a second chip surface, opposite to the first chip surface, the second set of one or more contacts being coupled to the one or more TSVs and the second set of one or more contacts to be coupled with contacts of a housing substrate. The invention also relates to other embodiments. |