| abstract |
The invention provides and a kind of include a kind of a kind of the first protruding and the bulge-structure of the second projection, semiconductor package part including this bulge-structure and method manufacturing this semiconductor package part.Described bulge-structure includes: first is protruding, is arranged on the connection pad of substrate, and described first projection includes the main body of the end of a plurality of nano wire and the described a plurality of nano wire of connection extended from described connection pad；Second is protruding, is arranged in the described main body of described first projection. |