| abstract |
The invention discloses a semiconductor die assembly having a high-efficiency thermal path and a molded underfill material. In one embodiment, a semiconductor die assembly includes a first die and a plurality of second die. The first die has a first functionality, a lateral region, and a stack of placement sites. The second die has a different functionality from the first die and the second die is in a die stack. The die stack includes a second die mounted on a bottom of a stacking site of the first die. And a top second die defining one of the top surfaces of the die stack. A heat transfer structure is attached to at least the lateral region of the first die and has a cavity in which the second die is positioned. An underfill material is located between the second die and the heat transfer structure in the cavity, and the underfill material covers the top surface of the die stack. |