| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip scale package for a wafer level stack package and a method of manufacturing the same, and to a through semiconductor manufacturing process without a critical process such as a laser drilling process for forming a through electrode and an insulating layer patterning process using a photosensitive film. In order to form an electrode, a wafer is formed by sawing at a predetermined depth along a chip cutting region of a semiconductor wafer, forming an insulating layer of an interlayer insulating material in the slot, and then forming a through electrode using a general semiconductor manufacturing process. A chip scale package for a level stacked package and a method of manufacturing the same are provided.n n n n Wafer Level, Stacked, Chip Scale Package, Slot, Insulation, Photoresist |