| abstract |
The present invention relates to a semiconductor package, comprising: a semiconductor chip mounted on a substrate, a molding film for molding the semiconductor chip, a heat slug disposed on the molding film, and an electrical connection between the substrate and the heat slug It may comprise a through mold via. The heat slug may be a capacitor structure provided with a dielectric between the conductors. According to the present invention, since the heat slug has a capacitor structure, the thermal characteristics of the semiconductor package as well as the electrical characteristics can be improved.n n n n Semiconductor Package, Heat Slug, PI, ESD, SI, EMI |