| abstract |
[Problem] To miniaturize a metal column.n[Solution] A semiconductor device which is provided with: a metal column 14 that stretches in a stretching direction; a polymer layer 16 that surrounds the metal column from a direction that intersects with the stretching direction; and a guide 12 that is apart from the metal column with the polymer layer intervening therebetween, and surrounds the polymer layer in the direction that intersects with the stretching direction. A method for manufacturing a semiconductor device, which comprises: a step for filling a guide 12 with a mixture 20 that contains metal particles 22 and a polymer 24; and a step for subjecting the mixture to a heat treatment so that a polymer layer 16, which is in contact with the guide, is formed by having the polymer agglomerate on the guide side and a metal column 14 that stretches in the stretching direction of the guide is formed from the metal particles by having the metal particles agglomerate in a space that is apart from the guide with the polymer layer intervening therebetween. |