patent/US-8802494-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8802494-B2

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filingDate	2012-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2014-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b19e20881d8a85a6cfa9ead1b2cd972 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b8ddeaef153f915896ed2973118633c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c881b86b030ec2bbfc355eccfb9a1b88
publicationDate	2014-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-8802494-B2
titleOfInvention	Method of fabricating a semiconductor device having an interposer
abstract	The method of fabricating a semiconductor device may include forming a semiconductor die on a substrate, forming an interposer including at least one integrated circuit connected to the semiconductor die on the substrate or on the semiconductor die, and performing encapsulation to surround the semiconductor die and the interposer.
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priorityDate	2009-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 107.