| abstract |
The present invention provides a semiconductor device which can suppress malfunction and decrease in reliability. A semiconductor device according to an embodiment includes a first memory chip having a first front surface and a first back surface, and a first memory circuit is provided on the first front side; and a second memory chip having a second front surface and a first 1 on the second back side opposite to the front side, a second memory circuit is provided on the second front side and is electrically connected to the first memory chip; and the logic chip is provided with the first memory between the second memory chip The chip has a third front surface and a third back surface. A logic circuit is provided on the third front surface side and is electrically connected to the first memory chip. |