| abstract |
In a conventional electronic device and a method for manufacturing the same, a resin used for a wiring layer on a solder ball side is limited, thereby preventing cost reduction of the electronic device. An electronic device includes a wiring layer (first wiring layer) and a wiring layer (second wiring layer). A wiring layer 20 is formed on the lower surface of the wiring layer 10. The wiring layer 10 has a via plug 12a (first conductive plug). The area of the end face on the wiring layer 20 side of the via plug 12a is larger than the area of the end face on the opposite side. The via plug 12a is exposed on the surface of the wiring layer 10 on the wiring layer 20 side. The thermal decomposition temperature of the insulating resin 14 constituting the wiring layer 10 is higher than the thermal decomposition temperature of the insulating resin 24 constituting the wiring layer 20. [Selection] Figure 1 |